Fuzhou Dr.H New Material develops and manufactures thermal conductive pads and conductive foam EMI shielding materials on an integrated line from silicone compounding to die-cutting, matching specifications to your structure and operating conditions.
Made from a silicone base with conductive fillers such as alumina, aluminium nitride and boron nitride, optionally using filler systems such as diamond, graphene and carbon nanotube, thermal pads fill the air gap between a heat source and its heat sink to reduce interfacial thermal resistance. Standard grades span 1.0–8.0 W/(m·K); custom grades built on high-conductivity filler systems reach 10–15 W/(m·K).
| Model | Thermal conductivity W/(m·K) | Specific gravity g/cm³ | Typical application |
|---|---|---|---|
| Dr.H-10 | 1.0 | 2.00 | Consumer electronics, general gap filling |
| Dr.H-15 | 1.6 | 2.15 | Power modules and LED drivers |
| Dr.H-20 | 2.0 | 2.30 | Industrial control boards, general TIM |
| Dr.H-30 | 3.0 | 2.90 | Telecom base-station power units |
| Dr.H-40 | 4.0 | 3.05 | Energy-storage PCS and vehicle electronic control modules (vehicle-grade qualification rests with the end product manufacturer) |
| Dr.H-50 | 5.0 | 3.20 | AI server chip interfaces |
| Dr.H-80 | 8.0 | 3.35 | Small-area, high heat-flux sources |
The table lists standard grades. The 10–15 W/(m·K) range is a custom option; grade names and values are subject to commercial confirmation and the actual test report.
| Type | Base and filler | Characteristics | Typical use | Supply |
|---|---|---|---|---|
| Standard silicone thermal pad | Silicone + alumina / aluminium nitride / boron nitride | General interface filling, wide range of hardness and thickness | Power modules, industrial control boards, telecom equipment | Standard |
| High-conductivity pad | Silicone + high-conductivity fillers such as diamond / graphene / carbon nanotube | Thermal conductivity up to 10–15 W/(m·K) | Small-area high heat-flux chips, AI computing modules | Custom |
| Phase-change pad | Silicone / paraffin-based phase-change system + conductive filler | Softens and wets the interface above the phase-change temperature, lowering contact resistance | Stable gaps where low interfacial resistance is required | Custom |
| Graphene pad | Graphene film / graphene composite layer | Strong in-plane conduction and heat spreading, spreads local hot spots | High power density chip spreading, thin devices | Custom |
| Ceramic heat spreader | Ceramic substrate such as alumina / aluminium nitride | Conducts heat while providing electrical insulation and dielectric strength | Power devices and modules requiring isolation | Custom |
| Thermal absorbing pad | Conductive filler + absorbing filler composite | Conducts heat while absorbing electromagnetic waves in target bands, covering both cooling and EMI | Enclosures with both thermal and interference requirements | Custom |
| Test item | Value | Unit | Test standard |
|---|---|---|---|
| Base material | Silicone + thermally conductive fillers (alumina / aluminium nitride / boron nitride / diamond / graphene / carbon nanotube) | — | — |
| Composition | Polysiloxane ≥70%, fillers 65%–75%, some grades fiberglass-reinforced | — | — |
| Color | Grey / white / pink / blue, standard or custom | — | To customer standard |
| Hardness | 10–50 ±5 | Shore C | ASTM D2240 |
| Dielectric strength | >4.5 | kV/mm | ASTM D149 |
| Volume resistivity | 1014 | Ω·cm | ASTM D257 |
| Flame grade | V0 | — | UL94—2018 |
| Operating temperature | -40 to 200 | °C | — |
| Environmental test | RoHS 2.0 halogen Pass | — | — |
| Adhesive backing | Optional | — | — |
| Fiber reinforcement | Optional | — | — |
| Thickness | 0.3–40.0 (adjustable range; standard supply subject to commercial confirmation) | mm | — |
All parameters are subject to the actual test report; specific grades and specifications are subject to commercial confirmation.
See thermal pad selection notes →
Conductive foam combines a polymer foam substrate with a conductive coating to be both elastic and conductive. Omnidirectional conductive foam uses a polyurethane foam core wrapped in conductive fabric applied by plating; the fabric is a polyester base vacuum-plated with nickel and copper to form a three-dimensional conductive network. It is used for EMI shielding and grounding across structural seams, and can be die-cut into strips, frames or custom profiles.
| Test item | Value | Unit | Test standard |
|---|---|---|---|
| Shielding effectiveness | ≥60–80 | dB | 10 MHz–3 GHz |
| Surface resistance | ≤0.05 | Ω/in² | 25.4 mm × 100 mm |
| Resistance at 20% compression | 0.05 | Ω | — |
| Compression range | 20–70 | % | Designed to the structural seam |
| Flame grade | V0 | — | UL94—2018 |
| Test item | Value | Unit | Test standard |
|---|---|---|---|
| Adhesive thickness | 0.05±0.005 | mm | — |
| Adhesive type | Acrylic | — | — |
| Initial tack | 3# and above | — | — |
| Adhesion | 1.8 | kg/25mm | — |
| Temperature resistance | -10 to 90 | °C | — |
| Resistance (vertical / horizontal) | 0.05 / 0.05 | Ω | — |
| Test item | Value | Unit | Test standard |
|---|---|---|---|
| Density | 45±5 | kg/m³ | JIS K7222 |
| Hardness | 85±5 | Asker F | — |
| Elongation | ≥80 | % | JIS K6400-5 |
| Tear strength | ≥0.4 | kg/cm | JIS K6400-5 |
| Tensile strength | ≥1.0 | kg/cm | JIS K6400-5 |
| Burning behaviour | A—0 mm/min | — | GB8410 |
| Heat resistance | 90±5 | °C | GB8410 |
| Test item | Value | Unit | Test standard |
|---|---|---|---|
| Base material | Ni+Cu+Polyester | — | — |
| Mesh count | 230T±10 | — | — |
| Base material thickness | 0.08±0.01 | mm | — |
All parameters are subject to the actual test report; specific grades and specifications are subject to commercial confirmation. Shielding effectiveness depends on compression state, mounting structure and test method, and should be validated at assembly level.
See conductive foam selection notes →
| Product | Form | Characteristics | Application with main ranges |
|---|---|---|---|
| Conductive fabric | Roll / sheet / die-cut part | Metal-plated polyester textile; flexible for wrapping | Wrapping, grounding and shielding reinforcement with conductive foam |
| Conductive copper foil tape | Roll / die-cut part | Copper foil with conductive adhesive for shielding and grounding | Seam bridging, grounding and local shielding reinforcement |
| Conductive aluminium foil tape | Roll / die-cut part | Aluminium foil with conductive adhesive; lightweight shielding | Weight-sensitive enclosure shielding and grounding |
| Thermal grease | Paste (syringe / can) | Paste-form TIM with low thermal resistance for thin gaps | Thermal supplement for very small gap interfaces |
| Thermal gel | Paste (dispensable) | Dispensable TIM suited to automated lines | Interfaces requiring automated dispensing and rework |
| Thermal double-sided tape | Sheet / die-cut part | Double-sided adhesive thermal pad for press-free bonding | Thermal interfaces that need press-free fixing |
Send us the heat source, power dissipation, assembly gap and operating temperature, and the team will propose a thermal pad or conductive foam specification.
Submit a Selection Request